Field Service Engineer

Duties and Responsibilities

• Install and qualify ASMPT’s Proprietary Semiconductor Equipment for high precision interconnection technology for different semiconductor applications.
• Analyze, interpret and make critical decision on process and equipment related issues.
• Leading and participating in complex service calls and interfacing with customers personnel to provide quality service and feedback on problem evaluation and resolution.
• Provides expert advice, training, and technical assistance to support both external and internal customers as needed
• Support machine FAT and SAT activities as defined by our customers.
• Understanding customer requirements to ensure system meets requirements and generate new business opportunities.
• Submits on time reports required. & perform other duties as assigned.

Education and Experience Requirements

• Bachelor's Degree in Materials, Mechanics, Chemistry, Physics or Microelectronics with a minimum of 1 - 2 years' experience in IC Packaging and Assembly related equipment

Note: Only candidates with a bachelor's degree as a minimum or AS Degree with a minimum 4-year Semiconductor Microelectronics or Automation experience will be considered

Other Requirements

• Must be willing to travel up to 70% of the time. Travel includes both International and Domestic
• Legally authorized to work in the US and able to travel overseas.
• Must be able to work with minimal supervision.
• Good written and oral communication and interpersonal skills
• Must be fluent in English, both written and spoken, intermediate to advanced Spanish language skills a plus
• Ability to logically troubleshoot complex hardware, software, application, and process related issues an convey this information in a way the customer understands
• Proficient in Microsoft Office programs.
• Knowledge and experience in Wire Bonding system and process.