Design Layout Engineer, Senior Staff - Advanced Packaging

Senior Staff Design Layout Engineer - Advanced Packaging

Currently hiring in Sunnyvale, Austin, Chandler and San Diego

We Are:

At Synopsys, we drive the innovations that shape the way we live and connect. Our technology is central to the Era of Pervasive Intelligence, from self-driving cars to learning machines. We lead in chip design, verification, and IP integration, empowering the creation of high-performance silicon chips and software content. Join us to transform the future through continuous technological innovation.

You Are:

You are a motivated and experienced Design Layout Engineer with a passion for advanced packaging and multi-die design implementation. You thrive in a collaborative environment and possess a strong background in physical design and SOC development. You have hands-on experience with industry-leading EDA tools and a deep understanding of backend implementation processes. Your expertise in advanced packaging technologies and chip-to-chip interfaces makes you a valuable asset to any team. You are eager to work on cutting-edge projects and contribute to the latest technological advancements in the industry. With your excellent communication skills and ability to work cross-functionally, you excel in a customer-centric environment and are ready to take on new challenges.

What You’ll Be Doing:

• Engaging with cross-functional teams to integrate multiple designs into a cohesive system.
• Utilizing Synopsys' advanced silicon design tools to provide end-to-end solutions, from architecture and design partitioning to floorplan, route, and simulation of advanced packaging designs.
• Gaining expertise in system and packaging implementation of chip-to-chip interfaces such as HBM3/4, UCIe, 3DIO, PCIe, and memory interfaces like DDR5 and LPDDR.
• Driving the progress of multi-die designs powering innovative GPUs and CPUs.
• Contributing to advancements in multi-die packaging technologies such as CoWoS, InFO, 3DIC.
• Occasionally traveling and working on-site at customer premises as required.

The Impact You Will Have:

• Advancing the state-of-the-art in multi-die design and packaging technologies.
• Helping customers achieve their design goals with industry-leading tools and methodologies.
• Enhancing the reliability, performance, and efficiency of cutting-edge silicon chips.
• Collaborating with industry partners to drive innovation in the semiconductor industry.
• Ensuring successful integration and implementation of advanced packaging solutions.
• Contributing to the development of the next generation of high-performance GPUs and CPUs.

What You’ll Need:

• BSEE/MSEE in Electrical and/or Computer Engineering.
• At least 8 years of experience in physical design and SOC development.
• Proficiency with Synopsys EDA tools such as 3DIC Compiler, IC Compiler II, or Fusion Compiler.
• Knowledge of backend implementation, simulation, and sign-off processes, including EMIR, ESD, STA, and thermal simulation.
• Understanding of CAD flows, tools, and design methodology development for backend tools.

Who You Are:

• Detail-oriented with strong analytical and problem-solving skills.
• Excellent communicator with the ability to work effectively in a team environment.
• Able to manage multiple tasks and projects simultaneously.
• Adaptable and open to learning new technologies and methodologies.
• Customer-focused with a commitment to delivering high-quality solutions.

The Team You’ll Be A Part Of:

You will be part of the System Solutions Group, a team dedicated to shaping solutions for dependable systems requiring safety, security, reliability, and low power. Our team collaborates with customers and industry partners to understand their needs and identify technical requirements. We are passionate about methodologies and automation, working together to make our customers' jobs easier as they develop their products.

Rewards and Benefits:

We offer a comprehensive range of health, wellness, and financial benefits to cater to your needs. Our total rewards include both monetary and non-monetary offerings. Your recruiter will provide more details about the salary range and benefits during the hiring process.