Technician 4, Engineering

Company:  Western Digital Technologies
Location: Fremont
Closing Date: 26/10/2024
Hours: Full Time
Type: Permanent
Job Requirements / Description

ESSENTIAL DUTIES AND RESPONSIBILITIES:Perform daily job duties to help in processing the HAMR wafers in CMP area.In-depth knowledge of slurry types, to help PE/EE/Chem identify if problem is slurry related and to make necessary changes if needed under given OCAPsPerform basic operation of different CMP tools in both manual and automatic mode as well as basic troubleshooting to identify if failure is CMP tool/process/recipe related.Perform basic operation of metrology tools (NANO, WYKO, ZYGO) as well as basic troubleshooting to identify if point of failure is metrology tool/recipe related.Perform non-standard process and can create/edit process recipe as well as create/edit wafer level CRMS.Good understanding of SPC chart and how to react to different warnings according to SPEC/OCAP as well as analyzing the CMP process/tool performance using basic knowledge in statistics/data analysis.Disposition hold wafer according to SPEC or disposition criteria provided by PE. Also capable of dispositioning hold wafer with own judgement based on risk assessment/process expertise / related previous experience.In-depth knowledge of IT-related application/software such as CRMs, APC, CMP calculator, MITECS, GS3, TSD report, EDCSPC, SPC chart, Fabtime, etc. Need to understand what data gets/goes from/to where.Notify PE/MFG if there's any suspected excursion. Do preliminary investigation and identify/hold all potentially affected wafers to contain the problem and minimize the impact.Basic understanding of different modules wafer process architecture and wafer build-up.Lead and support team project.OperationPrimary and backup tool allocation for each layer in CMP, specific to HAMRHold reasoning in detail.SPC chart non-conformances and reasoning.CMP EquipmentUnderstand consumables.Understanding MIRRA config, zones, presssure, etc.Understanding of carrier build on NTEGsUnderstanding Ebara configuration, top ring, dresser build and overall tool functionClear understanding of DNS, SSEC and Ebara cleaning tool configuration and recipe principalsSlurry configuration on the toolsCleaning chemicals on the toolsQualificationsPreffered AA Degree.5 or more years wafer manufacturing hands-on experienceMust have strong computer skills, including knowledge of Windows and proficiency with Microsoft Excel.Must be a self-starter and quick learner.Must be able to solve problems and troubleshoot minor process and equipment related issues.

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