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RF and High Speed Digital PCB Designer
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Date: Oct 3, 2024
Location:
Lexington, MA, US
Company:
MIT Lincoln Laboratory
The Electronics for Contested Space Group develops RF and advanced electronic systems for space control missions and technology in the protection of our Nation's most important space capabilities. This work includes the design and development of state-of-the-art satellites and satellite payloads, novel concepts for resilient space architectures, and the Nation's most sensitive radars, optics, and passive RF systems. Our group also collaborates across the Laboratory to provide engineering rigor and experience to some of the most critical Laboratory programs. Examples of recent projects include the prototyping of electronic systems and effects, hardware-in-the-loop testing of tactically-relevant payloads with surrogate threat systems, and RF subsystem development for satellites.
Job DescriptionA PCB Designer is needed for schematic capture and printed circuit board layout of RF, high speed digital, mixed signal, and power PCBs for ground and space-based systems. The ideal candidate is self-driven, has effective communication skills, and works effectively with small and large teams to meet the needs of the project. A typical project will include a subset of: schematic capture, printed circuit board layout, interfacing with mechanical, structural, and thermal teams, design documentation, and coordinating with fabrication and assembly houses.
Applicants must have significant experience in one or more of the following: RF layout, high-speed mixed signal layout, prototype print circuit board projects, high reliability design, or working with engineers from block diagram to printed circuit board. Experience with designs for space or other high reliability application preferred along with knowledge of IPC and Mil-Specs.
Requirements
A B.S. in Electrical Engineering, Associates Degree in Electrical/Electronics Engineering, or equivalent practical experience.
- Five or more years of experience in PCB design
- Experience with best practices for RF and high-speed digital layout
- Familiarity with IPC and IEEE standards
- Experience generating fabrication and assembly files and working with fabrication and assembly teams
- Demonstrated ability to interact with others respectfully and develop productive working relationships
- Demonstrated proficiency in oral and written communication
Desired Skills
- Familiarity working in high reliability design
- Experience with DxDesigner, Xpedition, and HyperLynx
- Experience with AutoCAD, Solidworks, or other software CAD
At MIT Lincoln Laboratory, our exceptional career opportunities include many outstanding benefits to help you stay healthy, feel supported, and enjoy a fulfilling work-life balance. Benefits offered to employees include:
- Comprehensive health, dental, and vision plans
- MIT-funded pension
- Matching 401K
- Paid leave (including vacation, sick, parental, military, etc.)
- Tuition reimbursement and continuing education programs
- Mentorship programs
- A range of work-life balance options
- ... and much more!
Please visit our Benefits page for more information. As an employee of MIT, you can also take advantage ofother voluntary benefits, discounts and perks.
Selected candidate will be subject to a pre-employment background investigation and must be able to obtain and maintain a Secret level DoD security clearance.
MIT Lincoln Laboratory is an Equal Employment Opportunity (EEO) employer. All qualified applicants will receive consideration for employment and will not be discriminated against on the basis of race, color, religion, sex, sexual orientation, gender identity, national origin, age, veteran status, disability status, or genetic information; U.S. citizenship is required.
Requisition ID: 41306
Nearest Major Market: Boston
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