Our vision is to transform how the world uses information to enrich life for all .
Micron Technology is a world leader in innovating memory and storage solutions that accelerate the transformation of information into intelligence, inspiring the world to learn, communicate and advance faster than ever.
Our Opportunity Summary:
For more than 43 years, Micron Technology, Inc. has redefined innovation with the world’s most advanced memory and semiconductor technologies. We’re an international team of visionaries and scientists, developing groundbreaking technologies that are transforming how the world uses information to enrich life.
We are looking for a strong candidate to become a Principal level Engineer which focuses on HBM Design. Are you passionate about systems and architecture for the next generation of high-performance memory that has wide-ranging applications and inspires change in memory systems? In the HBM Design Engineering team at Micron, we deliver novel solutions to increase bandwidth, and capacity and reduce latency across memory and storage solutions.
You will be part of a highly multi-functional team of technical domain experts collaborating closely with a worldwide team of Design Engineering, Product Engineering, Process Development, Package Engineering, and our Business Units to implement a common goal of ensuring our future HBM roadmap is successful. You will apply your deep understanding of memory array architectures, high-speed interface design, logic & custom circuit design, memory subsystem operation, high-performance computing architectures, and 2.5D & 3D package integration to understand and analyze bottlenecks and propose innovative architectures to target best-in-class performance, power, cost, reliability and quality for Micron’s HBM product portfolio.
In HBM DEG (High Bandwidth Memory - DRAM Engineering Group), we innovate and integrate end-to-end groundbreaking front-end and backend processes with groundbreaking design, debugging various tests, and qualification techniques to develop the lowest power per bit solutions to improve customer experience in the field of ML (Machine Learning) and AI (Artificial Intelligence). The success of a sophisticated product such as HBM relies vastly on vertical integration and the various engineering working in unison. To provide greater detail, our HBM technology pertains to stacking numbers of DRAM chips along with a logic chip within one package through an assembly technology called TSV (Through Silicon Via). This greatly increases the memory density in a package, while allowing very high-speed signal transmission. Furthermore, "high bandwidth"; is an outstanding memory design area where custom gate-level design and RTL style logic design are blended into the same product, and most of the DDR or LPDDR design is based on the gate-level design only. Lastly, verification and testing (validation) of HBM is the most challenging due to the total size of the design and complexity of the functions, and in addition to craft, many innovations are needed for verification and validation of the HBM product, thereby making it uniquely exciting.
What’s Encouraged Daily:
- Collaborate with the architecture team and external customers on new product specifications
- Pathfinding to explore new system-level solutions for future HBM products and make recommendations after performing highly technical feasibility analyses
- Drive interface logic chip and memory architecture solutions
- Develop circuit designs for the memory array, input buffer, output buffer, control logic, address decode, datapath, internal test logic, power generators, PLL
- Chip in experienced knowledge to advance innovative technical solutions
- Provide advice and counsel to senior management on significant technical issues
- Coordinate and lead the layout process, including placement and routing optimization
- Contribute to cross-group communication to work towards standardization and group success
- Proactively solicit feedback from Standards, CAD, modeling, and verification groups to ensure the design quality
- Drive innovation into the future Memory generations within a dynamic work environment
How To Qualify:
- MSEE or Greater
- 6+ years of relevant job/skill-related experience
- Experience delivering highly technical solutions
- In-depth technical expertise in one or more areas - DRAM memory array design, high-speed clocking and interface development, analog circuit design, digital/logic and custom circuit design, power delivery optimization, CMOS & semiconductor device physics, 2.5D and 3D packaging technologies
What Sets You Apart:
- Good verbal and written communication skills with the ability to efficiently synthesize and convey sophisticated technical concepts to other partners and leadership
- Proven track record of innovation and problem-solving in high-performance memory development
- A self-motivated, hard-working team player who enjoys working with diverse abilities and backgrounds
- Having an innovative approach that is open to improving upon any of our processes or products.
(Disclaimer): While you may not exhibit all of the characteristics/skills listed above today, we are highly interested in a teammate who is motivated to grow in technical breadth and depth. Suppose you are open to learning while being a valued member of a team of best-in-class engineers. In that case, we are determined to help build upon your existing foundation, while rapidly growing your individual and collaborative skills in this exciting and outstanding opportunity.
The US base salary range that Micron Technology estimates it could pay for this full-time position is:
$152,500.00 - $280,000.00
Our salary ranges are determined by role, level, and location. The range displayed on each job posting reflects the minimum and maximum target for new hire salaries of the position across all US locations. Within the range, individual pay is determined by work location and additional job-related factors, including knowledge, skills, experience, tenure and relevant education or training. The pay scale is subject to change depending on business needs. Your recruiter can share more about the specific salary range for your preferred location during the hiring process. Additional compensation may include benefits, discretionary bonuses and equity.
Micron is proud to be an equal opportunity workplace and is an affirmative action employer. All qualified applicants will receive consideration for employment without regard to race, color, religion, sex, sexual orientation, age, national origin, citizenship status, disability, protected veteran status, gender identity or any other factor protected by applicable federal, state, or local laws.
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To learn more about Micron, please visit micron.com/careers
US Sites Only: To request assistance with the application process and/or for reasonable accommodations, please contact Micron’s People Organization at or 1-800-336-8918 (select option #3)
Micron Prohibits the use of child labor and complies with all applicable laws, rules, regulations, and other international and industry labor standards.
Micron does not charge candidates any recruitment fees or unlawfully collect any other payment from candidates as consideration for their employment with Micron.
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