Focused Ion Beam (FIB) Engineer, Hardware Development

Company Description

At Western Digital, our vision is to power global innovation and push the boundaries of technology to make what you thought was once impossible, possible.

At our core, Western Digital is a company of problem solvers. People achieve extraordinary things given the right technology. For decades, we’ve been doing just that. Our technology helped people put a man on the moon.

We are a key partner to some of the largest and highest growth organizations in the world. From energizing the most competitive gaming platforms, to enabling systems to make cities safer and cars smarter and more connected, to powering the data centers behind many of the world’s biggest companies and public cloud, Western Digital is fueling a brighter, smarter future.

Binge-watch any shows, use social media or shop online lately? You’ll find Western Digital supporting the storage infrastructure behind many of these platforms. And, that flash memory card that captures and preserves your most precious moments? That’s us, too.

We offer an expansive portfolio of technologies, storage devices and platforms for business and consumers alike. Our data-centric solutions are comprised of the Western Digital, G-Technology, SanDisk and WD brands.

Today’s exceptional challenges require your unique skills. It’s You & Western Digital. Together, we’re the next BIG thing in data.

Job Description

ESSENTIAL DUTIES AND RESPONSIBILITIES

• Western Digital, the premiere producer of hard disk drives (WD and G-Technology brands) is seeking an engineer to prepare site-specific TEM lamella from HDD head wafer samples.
• The “heads” used to read and write information onto magnetic media in hard drives are manufactured on wafers using the same processes found in the semiconductor industry.
• There are over 100,000 heads on a single wafer, and critical features are on the nanometer size scale, with individual layers of material less than a single nanometer in thickness.
• The primary purpose of our work is to support the development and manufacture of the next generation of head reader technology.

Qualifications

REQUIRED

• Hands-on experience with site-specific sample preparation and experience with new generation TFS FIB tools is required. In-depth understanding of FIB automation is a plus.
• 3-5+ years of experience in related field
• BS or MS in Materials Science, Physics, or other related engineering discipline is required. Strong problem-solving abilities and the desire to work in a team environment are essential.
• The candidate will join a team of eight microscopists and sample prep engineers developing the next generation of Western Digital's storage technology.
• The candidate will work with and learn from experienced materials scientists and will work closely with the TEM engineers that will analyze the lamella.
• To increase access to our busy FIB instruments, we ask the candidate to work on Monday-Friday 6am-3pm or 2pm-11pm shift, particularly after we receive a new, state-of-the art instrument end of this year.