Advanced Packaging Engineer

Bold Thinking. World Changing. At SkyWater, our ingenuity helps improve lives around the world by manufacturing U.S. made semiconductors that are essential ingredients of modern life. Automotive safety enhancements, life-saving medical devices, consumer electronics and American security require semiconductors. Working in our Minnesota headquarters or Florida location, employees join together to improve the world.
Explore what's possible. Joining our U.S. - based team means contributing to and learning about the commercialization of some of the most exciting technologies the world has ever seen. We are turning "science fiction" into everyday reality through technologies such as superconducting, 3D integrated circuits or computer chips, carbon nanotubes, photonic logic devices, micro electro-mechanical systems and other emerging device topologies. We manufacture products for aerospace and defense, medical, automotive, consumer and industrial markets, to name a few. Our customers include emerging leaders who rely on our intellectual property security and quality manufacturing services.
Step into the future. SkyWater's values of Integrity, Excellence, Collaboration, Empowerment and Growth Mindset guide us to cultivate an empowered, learning environment. We also invest in developing highly skilled, dedicated employees - and employees who are entering the workforce for the first time, from the military, and a variety of educational backgrounds.
Are you bold thinking? Find your place on our team and help us change the world!
Position Summary:
We are looking for a hardworking and passionate Assembly and Packaging Engineer for our SkyWater Florida Advanced Packaging site. In this role you will lead, develop and improve advanced assembly processes for multiple application areas, including Fan-Out Wafer Level Packaging (FOWLP), interposers and other technology platforms. Excellent oral and written communication skills are required to effectively and efficiently communicate ideas with foundry customers, colleagues, and management.
You should have experience with process development and processing equipment in most of these areas: wafer back-end manufacturing processes, die singulation, pick & place and sorting, wire bonding, precision flip chip die bonding, underfills, encapsulation molding, micro-dispensing, optical alignment and final printed circuit board laminate assembly. Strong technical background in semiconductor device packaging with knowledge of high-density interconnect technologies, flip-chip surface mount assembly utilizing high density microbumps and fan-out-wafer-level-packaging (FOWLP) is highly preferred.
Responsibilities:

• Develop processes and act as subject matter expert for die attach, epoxy molding and precision high density flip chip.
• Developing new advanced packaging methods for next generation products in fan-out-wafer-level-packaging (FOWLP).
• Utilize program management methodology to plan, execute and monitor complex process and/or product development projects.
• Facilitate or lead cross-functional technical teams through New Product Introduction (NPI) and process improvement.
• Design for manufacturability and cost to ensure smooth transition to High Volume Manufacturing.
• Develop and deploy advanced design rules into next generation products.

• Determining root causes of failures using statistical methods and recommend changes in designs, tolerances, or processing methods.
• Utilize Lean Manufacturing techniques to reduce manufacturing costs and improve manufacturing yield.
• Investigate or resolve operational problems, such as material use variances or bottlenecks.
• Preparing and maintaining documentation for manufacturing processes and engineering procedures.
• Incorporating automation into manufacturing processes.
• Reviewing product designs for manufacturability or completeness.

The job also requires performing other duties as assigned. Percentages of time spent on job duties are estimates and may vary for each position.
Required Qualifications:
Education: BS Engineering, MS/PhD preferred. Physics, Electrical Engineering, Materials Science or equivalent.
Experience and Skills:

• U.S. Person Required: SkyWater Technology Foundry, Inc. subject to the International Traffic in Arms Regulations (ITAR). All accepted applications must be U.S. Persons as defined by ITAR. ITAR defines a U.S. Person as U.S. citizen, U.S. Permanent Resident, Political Asylee, or Refugee.
• Minimum of 5 years (10 years preferred) of experience in semiconductor packaging engineering, with a comprehensive understanding of advanced packaging technologies such as 2.5D, 3D IC, Flip Chip, WLCSP, and Fan-Out.
• Experience working in a manufacturing and/or cleanroom environment.
• Experience working and developing processes on manufacturing equipment.
• Experience with project management tools, such as Gantt charts, to plan and communicate project and development status.
• Knowledge of reliability test methods and qualification procedures.
• Experience with wire bonding, hermetic sealing, automatic pick and place, flip chip assembly and solder reflow.
• Proficiency in material and package characterization data analysis, and statistical data analysis.
• Proficient in DOE and SPC. Knowledge of 6-sigma concepts and applications.
• Can work both independently and in (or lead) cross-functional teams for problem solving.
• Desire to work in a fast-paced, challenging, and risk-taking environment.
• Desire to be part of a team that will transform the electronics industry in the United States.

SkyWater has an exciting environment where the brightest semiconductor minds come together to achieve exceptional results. We offer competitive salary and financial benefits, such as, bonuses, life insurance, 401k match, and opportunities to buy SkyWater stock at a discounted rate.
We provide benefits that promote a healthy life, such as, comprehensive benefits package including benefit eligibility day one, paid time off, paid holidays, an on-site fitness facility, an on-site, self-serve market and so much more!
SkyWater is an Equal Opportunity/Affirmative Action Employer. Applicants for all job openings are welcome and will be considered without regard to age, sex, sexual orientation, gender identity, transgender status, pregnancy, childbirth or related medical condition, race, color, creed, religion, national origin, ancestry, physical or mental disability, genetic characteristics, medical conditions, family care or medical leave status, military service or status as a Protected Veteran, marital status, familial status, membership or activity in a local human rights commission, status with regard to public assistance, or any other basis protected by applicable federal, state or local laws ("Protected Characteristics"). SkyWater complies with all applicable federal, state and local laws concerning EEO/AA employment. SkyWater complies with federal and state disability laws and makes reasonable accommodations for applicants and employees with disabilities. If reasonable accommodation is needed to participate in the job application or interview process, to perform essential job functions, and/or to receive other benefits and privileges of employment, please contact Human Resources at 952-851-5200 or
Other details

• Job Family Engineering
• Pay Type Salary

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