Advanced Packaging Senior Staff Engineer

Company:  Marvell Semiconductor, Inc.
Location: Boise
Closing Date: 19/10/2024
Salary: £150 - £200 Per Annum
Hours: Full Time
Type: Permanent
Job Requirements / Description

About Marvell

Marvell's semiconductor solutions are the essential building blocks of the data infrastructure that connects our world. Across enterprise, cloud and AI, automotive, and carrier architectures, our innovative technology is enabling new possibilities.

At Marvell, you can affect the arc of individual lives, lift the trajectory of entire industries, and fuel the transformative potential of tomorrow. For those looking to make their mark on purposeful and enduring innovation, above and beyond fleeting trends, Marvell is a place to thrive, learn, and lead.

Your Team, Your Impact

Marvell's Advanced Packaging team is seeking a talented engineer to help solve challenging power integrity problems for our next generation applications.

What You Can Expect

This engineer will be responsible for helping to develop the advanced packaging power integrity design flow for the Marvell advanced packaging organization. This may include helping to automate the transfer of data between the chip design flow and the package design flow or between package design tools. It will also require hands-on power integrity analysis for challenging next generation processor & data center applications.

This is a hybrid role requiring 2 days a week of on-site office work.

What We're Looking For

Requirements

Bachelor's degree in Computer Science, Electrical Engineering or related fields and a minimum of 10 years of related professional experience.

Job Requirements

  • Must have n understanding the frequency domain and time domain knowledge of high speed signaling

  • Experience in using 2-D and 3-D EM simulation tools such as Ansys HFSS, SI-Wave, Cadence Clarity

  • Experience in Power plane design, modeling and analysis using tools like PowerSI, SIwave

  • Familiarity with packaging technologies, materials, package substrate design rules and assembly rules is highly desired

  • Knowledge of the thermal and mechanical analysis of the 2.5 & 3D package development is a plus

  • Strong computer programming skills are required

  • Must have strong teamwork skills

Expected Base Pay Range (USD)

114,800 - 169,830, $ per annum

The successful candidate's starting base pay will be determined based on job-related skills, experience, qualifications, work location and market conditions. The expected base pay range for this role may be modified based on market conditions.

Additional Compensation and Benefit Elements

At Marvell, we offer a total compensation package with a base, bonus and equity.Health and financial wellbeing are part of the package. That means flexible time off, 401k, plus a year-end shutdown, floating holidays, paid time off to volunteer. Have a question about our benefits packages - health or financial? Ask your recruiter during the interview process.This role is eligible for our hybrid work model in which you will be able to split time between working from home and on-site in a Marvell office.

All qualified applicants will receive consideration for employment without regard to race, color, religion, sex, national origin, sexual orientation, gender identity, disability or protected veteran status.

Any applicant who requires a reasonable accommodation during the selection process should contact Marvell HR Helpdesk at

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Marvell Semiconductor, Inc.
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