Project Engineer

Company:  OSI Systems, Inc.
Location: Hawthorne
Closing Date: 01/11/2024
Salary: £100 - £125 Per Annum
Hours: Full Time
Type: Permanent
Job Requirements / Description

Overview

OSI Systems companies have a long history of developing innovative solutions to bring a better quality of life to the world. With more than 30 years of combined experience in the field of optoelectronics, our OSI Optoelectronics (OSIO) division is a diversified manufacturer of standard and custom photodiodes and optical sensors for use in aerospace, defense, commercial and medical applications.

We are one of the largest global manufacturers of optoelectronic devices, delivering engineering design support and manufacturing capabilities that include products for use in the defense, aerospace, medical, and industrial markets, among others. We utilize our world-class manufacturing facilities in the U.S., India and Malaysia to continue to put forth excellent engineering solutions aligned with efficient manufacturing to meet high-volume production requirements.

OSI Optoelectronics is seeking a Project Engineer. This individual will support various military, aerospace and space level microelectronics and optoelectronic programs.

Responsibilities

  • Develops and/or proposes package design/selection, defines silicon chip attach method, suggests electro-optical test parameters, develops assembly sequence/methods process travelers, recommends material selection and other specific component requirements as deemed necessary for the successful launch of programs.
  • Reviews all aspects of the various programs under his/her responsibility for schedule compliance, risk mitigation and program build/delivery recovery (in the event of unforeseen delays).
  • Advises sales and communicates with customers of Hi-Rel Program on program status - this can and often occurs weekly and at times daily.
  • Interfaces with Test Engineering, Quality Engineering, Device Engineering, Document Control, Process Engineering, Planning and Purchasing to lead and spearhead all efforts requiring his/her involvement to assure and ensure successful documentation/drawing submittals, material procurement, silicon wafer starts, unique specification/procedure generation, Project Milestone Timelines (detailed), assembly travelers and supplier guidance (as required).
  • Provides sustaining engineering support to assigned programs.
  • Uphold the company’s core values of Integrity, Innovation, Accountability, and Teamwork.
  • Demonstrate behavior consistent with the company’s Code of Ethics and Conduct.
  • It is the responsibility of every employee to report to their manager or a member of senior management any quality problems or defects in order for corrective action to be implemented and to avoid recurrence of the problem.
  • Duties may be modified or assigned at any time to meet the needs of the business.

Qualifications

  • Bachelor’s degree in Electrical Engineering or related field required; Mechanical/Electrical Engineering preferred; specific hands-on experience will be considered in lieu of formal advanced education.
  • Minimum 3 years of Product or Project Engineering experience in the field of semiconductor product manufacturing required (working directly with line manufacturing, coordinating development efforts, documentation, process activities, customer communication, solving problems, providing project status updates, and reliability reports, etc).
  • Must have knowledge of manufacturing processes such as (yet not limited to): die attach, wirebond, die shear, fine and gross leak testing, wirebond pull, hermetic sealing (TO-can and other custom configurations) - projection weld, seam seal, laser weld, DAP Sealing (specific for inert gas eutectic component or window attach), soldering (J-Std level knowledge).
  • Technical experience in the field of microelectronics/ photonics (primarily with silicon, InGaAs diode and GaAs technology) required.
  • Knowledge of military standards required.
  • Mechanical design (AutoCAD, Solid Works, etc) experience and ability for custom package, substrate, window cap configurations is preferred.
  • Must be able to complete job responsibilities working with different time zone needs such as attending late night/ early morning meetings by phone and/or web to meet business needs.
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OSI Systems, Inc.
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