Principal Engineer, Memory Systems Architecture

Please Note:

To provide the best candidate experience with our high application volumes, we limit applications to a total of 10 over 6 months.

Advancing the World's Technology Together
Our technology solutions power the tools you use every day-including smartphones, electric vehicles, hyperscale data centers, IoT devices, and so much more. Here, you'll have an opportunity to be part of a global leader whose innovative designs are pushing the boundaries of what's possible and powering the future.

We believe innovation and growth are driven by an inclusive culture and a diverse workforce. We're dedicated to empowering people to be their true selves. Together, we're building a better tomorrow for our employees, customers, partners, and communities.

What You'll Do

The AGI (Artificial General Intelligence) Computing Lab is dedicated to solving the complex system-level challenges posed by the growing demands of future AI/ML workloads. Our team is committed to designing and developing scalable platforms that can effectively handle the computational and memory requirements of these workloads while minimizing energy consumption and maximizing performance. To achieve this goal, we collaborate closely with both hardware and software engineers to identify and address the unique challenges posed by AI/ML workloads and to explore new computing abstractions and hardware designs that can provide a better balance between the hardware and software components of our systems. Additionally, we continuously conduct research and development in emerging technologies and trends across HBM, compute, interconnect, and AI/ML workloads, ensuring that our platforms are always equipped to handle the most demanding workloads of the future. By working together as a dedicated and passionate team, we aim to revolutionize the way AI/ML applications are deployed and executed, ultimately contributing to the advancement of AGI in an affordable and sustainable manner. Join us in our passion to shape the future of computing!

Location: Hybrid, working onsite at our office 3 days per week with the flexibility to work remotely the remainder of your time

Reports to: SVP

• Collaborate with cross-functional teams involved in designing memory array architectures, on-die and off-die high-speed signaling, PHY & interface development, power delivery network planning and optimization, CMOS requirements identification, packaging technologies, and thermal modeling, to ensure that the requirements for the next generation HBM architecture meet the needs of datacenter AI applications.
• Work with the HBM path finding team to help define and develop the next-generation HBM architecture requirements, including technical requirements, performance metrics, and interface protocols.
• Work with industry partners to ensure compatibility and interoperability across different platforms and applications. Represent Samsung at JEDEC for developing next-generation HBM specification.
• Conduct market research and stay up-to-date with the latest trends and advancements in HBM technologies, including emerging applications and use cases.
• Lead technical discussions and presentations at industry conferences and events, showcasing the benefits and advantages of the next-generation HBM for AI applications.
• Mentor and guide junior engineers, providing technical guidance and support to help them develop their skills and expertise in the field of memory technologies.
• Ensure compliance with all relevant regulations and standards, including intellectual property protection and data privacy.

What You Bring

• BS in Computer/Electrical Engineering or Computer Science with 20+ years of working experiences in silicon development or MS in Computer/Electrical Engineering or Computer Science with 18+ years of relevant working experience or PhD and 15+ years of relevant working experience preferred.
• 10+ years of experience in the design and development of memory technologies, with a strong background in HBM and other high-performance memory solutions.
• Excellent technical writing skills, with the ability to communicate complex technical concepts in a clear and concise manner.
• Strong leadership skills, with the ability to work collaboratively with cross-functional teams and industry partners.
• Deep understanding of HBM 3, HBM 3E and HBM 4 JEDEC standards.
• Excellent project management skills, with the ability to manage multiple projects and deliverables simultaneously.
• Strong communication skills, with the ability to present technical information to non-technical stakeholders.
• You're inclusive, adapting your style to the situation and diverse global norms of our people.
• An avid learner, you approach challenges with curiosity and resilience, seeking data to help build understanding.
• You're collaborative, building relationships, humbly offering support and openly welcoming approaches.
• Innovative and creative, you proactively explore new ideas and adapt quickly to change.