Company:
Nexperia
Location: Englewood Cliffs
Closing Date: 16/10/2024
Salary: £100 - £125 Per Annum
Hours: Full Time
Type: Permanent
Job Requirements / Description
POSITION SUMMARY:
The incumbent will spearhead the execution of R&D technology track package development initiatives, focusing on the creation and development of new packages. This involves adhering to the Back end BCaMx procedure and process methodology for the release of new packages. As a project leader, the candidate will guide a multidisciplinary team to ensure the delivery of package releases that meet the specified project objectives, outcomes, and timelines. The role requires strict adherence to the agreed project plan, specifications, quality standards, timing, budget, and reporting requirements.
KEY DUTIES AND RESPONSIBILITIES:
- Lead a project team to achieve project goals and adhere to the timeline, managing projects with budgets less than $1M.
- Strategize, manage, and oversee the program/project, incorporating risk management practices.
- Facilitate the coordination of activities and resources to ensure the punctual attainment of each project gate and milestone.
- Make all operational decisions to ensure the successful completion of project objectives in terms of timing, quality, and financial management.
- Serve as the primary point of contact for project-related communications, acting as the representative for MEEQ and OPEX team (BE A/T, xJDT, CRUX).
- Assemble and direct the project team, delegating responsibilities to team members effectively.
- Maintain a constant focus on project quality, track progress, and guarantee that project goals are achieved.
- Recognize and handle project changes, adjusting the project strategy as needed.
SKILLS AND ABILITIES:
- Proficient in leading teams to address standard issues utilizing methodologies such as 8D, Why-Why analysis, and FMEA.
- Possess a solid understanding of package assembly process engineering.
- Experienced in applying project management principles throughout the project lifecycle, from initiation and planning to closure, including reporting and documentation.
- Capable of communicating effectively in both English and Chinese.
- Demonstrates strong interpersonal skills and leadership qualities, including the ability to foster teamwork and build effective teams.
- Exhibits a strong drive for problem-solving and provides prompt responses to both internal and external customers.
EDUCATION AND EXPERIENCE:
- A Bachelor’s degree in Engineering or a related field.
- A minimum of 5 years of industry experience, with at least 2 years in a leadership role overseeing R&D package development projects.
- Proven experience with SOT, QFP, TSOP, and DFN package types.
- Knowledgeable in package assembly process engineering.
- Basic understanding of package design is considered an asset.
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