DUTIES/RESPONSIBILITIES:
Manage the plating process and technology, overseeing operation and ensuring the successful execution of projects and tasks.
Develop and implement strategies to optimize plating processes, improve efficiency, and meet production targets.
Collaborate with other technical leaders to support new product development and process improvements.
Provide technical guidance and mentorship to engineers, operators, and other team members.
Oversee equipment maintenance, calibration, and upgrades to ensure optimal performance.
Develop and maintain documentation including standard operating procedures (SOPS), work instructions, and process specifications.
Monitor and analyze KPIs to track progress, identify areas for improvement, and drive corrective actions.
Stay updated on industry trends, emerging technologies, and best practices in plating and substrate manufacturing.
REQUIREMENTS:
- Proven track record of leadership and management in a substrate for semiconductor manufacturing.
- Strong technical expertise in plating equipment, processes, and chemical materials.
- Excellent problem-solving skill and ability to make data-driven decisions.
QUALITIFICATIONS:
- In-depth technical knowledge of relevant process and industry
- Effective communication skills and ability to collaborate with colleagues.
- Must be at least 18 years old and authorized to work in the United States
EDUCATION:
Bachelor's or master's degree in engineering or science related to chemistry
EXPERIENCE:
5+ year of Engineering experience in the substrate for semiconductor with a focus on plating processes or materials