Principal Plasma Etch Process Engineer / Senior Principal Plasma Etch Process Engineer

Requisition ID: R10171710

• Category: Engineering
• Location: Linthicum, Maryland, United States of America
• Clearance Type: Secret
• Telecommute: No - Teleworking not available for this position
• Shift: 1st Shift (United States of America)
• Travel Required: Yes, 10% of the Time
• Relocation Assistance: Relocation assistance may be available
• Positions Available: 1

At Northrop Grumman, our employees have incredible opportunities to work on revolutionary systems that impact people's lives around the world today, and for generations to come. Our pioneering and inventive spirit has enabled us to be at the forefront of many technological advancements in our nation's history. We look for people who have bold new ideas, courage and a pioneering spirit to join forces to invent the future, and have fun along the way.

The Northrop Grumman Microelectronics Center (NGMC) of Northrop Grumman Mission Systems is seeking an exceptionally talented, motivated, and creative Plasma Etch Process Engineer for our Advanced Technology Lab (ATL) - located outside of Baltimore, Maryland.

The candidate must be a strong team participant, have excellent communication skills, and be resourceful and multitalented. A strong understanding of semiconductor technology, metrology processes, and equipment engineering is essential.

The Plasma Etch Process Engineer will be responsible for but not limited to:

• All aspects of process development, optimization and ownership of Plasma Etch processes for semiconductor manufacturing.
• Interfacing with other unit process engineers and product integration engineers to develop plasma etch processes to support emerging technologies.
• Supporting statistical process control (SPC) and continuous improvement efforts.
• Establishing standard operating procedures and engaging the operations team to ensure these are followed.
• Responsible for the procurement and start-up of new process equipment and processes.
• Performs all other related duties as assigned.

This requisition may be filled as a Principal Plasma Etch Process Engineer or Senior Principal Plasma Etch Process Engineer .

Basic Qualifications Principal Plasma Etch Process Engineer:

• Bachelor’s Degree or higher in Materials Engineering, Chemical Engineering, Electrical Engineering, Physics, Chemistry, or closely related discipline with 5 years technical related experience in semiconductor fabrication; Master’s Degree with 3 years experience; or PhD with 0 years experience.
• Have understanding/knowledge of semiconductor Plasma Etch processes or other related semiconductor processing.
• Able to work independently with hands-on experience in operating tools, gathering, and analyzing data.
• Candidate must possess good interpersonal and communication skills, both written and verbal, problem-solving skills with ability to work with a diverse group of people.
• US citizenship required.
• Must be able to obtain and maintain a Secret Clearance.

Basic Qualifications Senior Principal Plasma Etch Process Engineer:

• Bachelor’s Degree or higher in Materials Engineering, Chemical Engineering, Electrical Engineering, Physics, Chemistry, or closely related discipline with 8 years technical related experience in semiconductor fabrication; Master’s degree with 6 years of experience; or PhD with 3 years of experience.
• Development and optimization of plasma etch processes to meet physical and electrical requirements of superconducting and/or silicon technologies/devices.
• Able to work independently with hands-on experience in operating tools, gathering, and analyzing data.
• Candidate must possess good interpersonal and communication skills, both written and verbal, problem-solving skills with ability to work with a diverse group of people.
• US citizenship required.
• Must be able to obtain and maintain a Secret Clearance.

Preferred Qualifications:

• Process development experience in Plasma Etching.
• Experience in superconductor microelectronics will be highly desired.
• Experience in lean manufacturing practices and structured problem-solving methodology.
• User of various software packages commonly found in Semiconductor Wafer Fabs.
• Active Secret Clearance.

Salary Range: $102,400 - $153,600

Salary Range 2: $127,000 - $190,600

Northrop Grumman is committed to hiring and retaining a diverse workforce. We are proud to be an Equal Opportunity/Affirmative Action Employer. U.S. Citizenship is required for all positions with a government clearance and certain other restricted positions.