Requisition ID: R10169729
Category: Engineering
Location: Linthicum, Maryland, United States of America | Annapolis Junction, Maryland, United States of America
Clearance Type: None
Telecommute: No- Teleworking not available for this position
Shift: 1st Shift (United States of America)
Travel Required: Yes, 10% of the Time
Relocation Assistance: Relocation assistance may be available
Positions Available: 1
Northrop Grumman Mission Systems (NGMS) Advanced Capabilities division is seeking experienced RF Engineers to join our team and develop high-performance computing systems. You’ll work in a fast-paced environment alongside physicists, design engineers, and superconducting foundry engineers.
How you will contribute to the Mission:
Designing, modeling, and verifying RF, microwave, and mixed signal subsystem assemblies
Support verification efforts for RF, Analog, and Digital hardware designs
Collaborating with peer functions such as Mechanical, Manufacturing, Test, and IC design Engineers
Deriving and trading requirements with subsystem engineers and component level designers
Working directly with component level design peers developing custom RF integrated circuit designs to meet assembly-level requirements
Basic Qualifications for the RF Engineer Level:
Bachelor’s degree in Electrical Engineering or related STEM degree and 12 years of relevant work experience required. Master's degree and 10 years of experience
Working knowledge of an EM simulation tool (HFSS, CST Studio, Sonnet, ADS, HSPICE, SI-Wave, Sigrity)
Experience working with software programming languages
Prior experience working with electronics, mechanical requirements, and schematic drawings
Hands-on experience utilizing test instrumentation such as power supplies, network analyzers, oscilloscopes, spectrum analyzers, high-speed digital IO
Must have the ability to obtain and maintain an active U.S. Top Secret/SCI with Poly Security Clearance
U.S. Citizenship is a requirement
Preferred Qualifications:
Well versed in working with Ansys HFSS modeling for RF packaging effects
Experience with spectrum and network analyzer techniques for EMC measurements
Prior experience with packaging technologies (e.g., ceramic and laminate chip-level packages, printed circuit boards, interposers, wire bonding, etc.)
Experience with cryogenic test stands, superconductivity and mechanical CTE
Salary Range: $157,500 - $236,300
Northrop Grumman is committed to hiring and retaining a diverse workforce. We are proud to be an Equal Opportunity/Affirmative Action Employer.
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