Sr. Staff Substrate Packaging Engineer

Company:  FormFactor, Inc.
Location: Livermore
Closing Date: 19/10/2024
Salary: £100 - £125 Per Annum
Hours: Full Time
Type: Permanent
Job Requirements / Description

Position: Sr. Staff Substrate Packaging Engineer

Location: Livermore, CA

Job Id: 5492

# of Openings: 1

Sr. Staff Substrate Packaging Engineer

FormFactor, Inc

Livermore, CA

In a world driven by the increased demand of technology, semiconductor manufacturers require a trusted partner to pioneer the frontiers of advanced integrated circuits (ICs). FormFactor, Inc (FFI) is the world's leading supplier of semiconductor test and measurement products that power electronic systems used in computing, consumer-technology, automotive, Artificial Intelligence (AI) and other applications.

As a leading player in the semiconductor industry, FormFactor actively seeks out individuals who are not just employees, but passionate contributors eager to thrive in an ever-evolving landscape. At FormFactor, we are not just shaping the future of semiconductors; we are rewriting the narrative of innovation itself.

Our commitment extends beyond the technical realm to the very fabric of our culture. Rooted in our core values - Focus on the Customer, Ownership & Accountability, Respectfully & Effectively Communicate, and Motivate & Develop People - we foster an environment where diverse perspectives are not only welcomed but celebrated.

PURPOSE:

We are looking for a highly experienced, motivated, and team-oriented substrate packaging engineer to work in a fast-paced R&D team. The candidate will be responsible for substrate technology roadmap, technology development and drive the engagement between internal and external design requirements and substrate supplier's capabilities. You will work closely with different substrate packaging suppliers to meet stringent requirements and schedule.

ESSENTIAL DUTIES AND RESPONSIBILITIES

  • Responsible for substrate technology development, roadmap, and capabilities
  • Drive substrate design rules, stackup, materials, process flow and reliability of the finished substrate.
  • Design and develop new assembly methodologies, process technologies, engineering DOEs to identify critical process parameters and establish process windows
  • Design PCB, MLO, MLC substrates using design and layout software/tools.
  • Perform design rule checks for design verification of the next generation multilayered packaging substrates.
  • Work closely with local and international substrate packaging suppliers to develop new processes.
  • Collaborate with cross-functional teams such as design, reliability, operations, assembly and test for successful development of new product.
  • Develop company level packaging roadmap that aligns with new product roadmap and qualify new packaging technologies in line with new products.

EDUCATION, EXPERIENCE, AND SKILLS REQUIRED

  • B.S Degree in Electrical Engineering, Mechanical Engineering, Materials Science or equivalent required
  • Master's Degree or Ph.D preferred
  • Minimum 12 years of work experience in substrate packaging technology
  • Experience in use of advanced packaging technologies like CuP, WLCSP, SMT, Flip Chip, Wirebonding, BGA, Component assembly etc is required.
  • Must have experience with substrate design, design rules, physical routing, and tools (including AutoCAD, Allegro etc)
  • Experience with substrate technology like laminates, prepreg, core, blind, buried microvias etc.
  • Strong background in failure analysis, root cause analysis, process engineering (DOE, 8D, SPC, document control, etc.)
  • Understanding of IPC/JEDEC design rules and standards is a must have. CID+ certification will be preferred.
  • Travel both locally and internationally to resolve supplier issues and attend review meetings.
  • Strong project management, communication and collaborative skills
  • Comfortable working in a fast-paced and multidisciplinary team

The pay range for this role in Livermore, CA is between $163,400 and $214,620. The pay range may differ in other locations. FormFactor maintains broad salary ranges for its roles in order to account for variations in education, training, skills, relevant work experience, business needs and market demands.

FormFactor is committed to providing a work environment where everyone is treated with dignity and respect. We are an Equal Employment Opportunity (EEO) employer and are committed to compliance with all Federal, State, and local laws that prohibit employment discrimination on the basis of age, race, color, sex (including breastfeeding and related conditions), gender (including gender identity and gender expression), national origin, ancestry, sexual orientation, religion, physical or mental disability, marital status, registered domestic partner status, medical condition, military or veteran status, genetic characteristics or information, or any other legally protected characteristic.

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