Failure Analysis Engineering Intern

Company:  Qorvo
Location: Hillsboro
Closing Date: 06/11/2024
Salary: £100 - £125 Per Annum
Hours: Full Time
Type: Permanent
Job Requirements / Description

Qorvo is All Around You! We manufacture innovative RF solutions at the center of connectivity to enable high-performance applications for advanced wireless devices, wired and wireless networks, and defense radar and communications for 5G networks, cloud computing, the Internet of Things, and other emerging applications. We are a global company thriving on a culture of innovation, diversity, and inclusion. Our people are always at the core of Qorvo’s innovation. Qorvo is a place to stretch your imagination and push boundaries to achieve success. Learn more about Top 10 Reasons to make a career at Qorvo.

Qorvo’s Internship Program is designed for college students currently enrolled in an accredited Bachelor’s, Master’s, or PhD program. Qorvo offers real work experience, exposure to upper management, and the opportunity to pursue full-time opportunities, as available.

Qorvo’s Internship Program offers:

  • Challenging, skill-building assignments
  • Mentoring and coaching from industry experts
  • Lunch & Learns and other learning opportunities
  • Collaborative team-based work environment
  • Networking and social events
  • Final presentation to business leaders

Qorvo’s Internships are offered in our High Performance Analog, Advanced Cellular, Connectivity and Sensors, and Global Operations business groups. Specific projects and responsibilities will be determined based on the business needs at the time of the internship assignment.

Responsibilities may include:

  • Completing root cause physical analysis of electrical failures on a wide range of Qorvo semiconductor devices for internal and external customers
  • Learning the operation and application of standard failure analysis tools including Optical, Electron, X-ray and Acoustic microscopy, Parameter Analyzers, Wet and Dry chemical die de-processing techniques, and fault isolation emission techniques such as OBIRCH, Infra-Red and Photon Emission microscopy
  • Clearly communicating results through written failure analysis reports
  • Successfully handling multiple analyses in parallel

Qualifications:

  • Currently pursuing a BS, MS, in Materials Science, Electrical Engineering, Mechanical Engineering, Physics, or similar degree field
  • Minimum 3.0 GPA
  • Semiconductor and circuit device coursework and/or experience
  • Proficiency with Microsoft Office (Excel, Word, PowerPoint)
  • Self-Starter with strong written and verbal communication skills
  • Strong organization skills and attention to detail

This position is not eligible for Visa sponsorship by the company.

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