Principal / Senior Principal Microelectronic Packaging Mechanical Design Engineer

Principal / Senior Principal Microelectronic Packaging Mechanical Design Engineer

Requisition ID: R10170567

• Location: Baltimore, Maryland, United States of America
• Clearance Type: Secret
• Telecommute: Yes-May consider hybrid teleworking for this position
• Shift: Days (United States of America)
• Travel Required: Yes, 10% of the Time
• Relocation Assistance: Relocation assistance may be available

Northrop Grumman Mission Systems is seeking a Principal / Senior Principal Mechanical Electronic Packaging Engineer to join our team of qualified, diverse individuals. This position will be located in Linthicum, Maryland.

Overview:

You will work as part of a cross-functional team that is responsible for the design and development of cutting-edge AESA antenna hardware that is featured in Northrop Grumman's world-class radar, ESM and communications systems. You'll support multiple projects spanning the product lifecycle, from R&D to full-rate production.

This position may be filled as a Principal Mechanical Electronic Packaging Engineer or a Senior Principal Mechanical Electronic Packaging Engineer.

This position is contingent on the ability to obtain or maintain a US Secret Clearance or higher and contract award.

Roles and Responsibilities include:

• Design, prototyping and production support of state-of-the-art RF, digital, and mixed signal multi-chip modules (MCMs), Printed Wiring Boards (PWBs), and Circuit Card Assemblies (CCAs) using various substrate materials and chip-scale packaging technologies.
• Collaboration within a cross-functional Integrated Product Team (IPT); effective and timely communication with peers in adjacent functions, including electrical design, systems engineering, thermal analysis, structural analysis, drafting, supply chain management and manufacturing.
• Organizing and prioritizing tasks in order to accomplish project milestones within schedule and budgetary constraints.
• Providing technical leadership and mentoring to less experienced personnel.

Basic Qualifications for Principal Mechanical Electronic Packaging Engineer:

• Bachelor’s degree with 5 years of experience, a Master’s degree with 3 years of experience or a PhD with 0 years of experience in Mechanical Engineering, Electrical Engineering, Computer Engineering, Computer Science, or related technical fields. Will consider 9 years of applied experience in lieu of degree requirement.
• U.S Citizenship with the ability to obtain/maintain an active DoD Secret Clearance.
• Experience with microelectronic packaging design, including chip-scale packaging technologies and substrate/PWB layout.
• Working knowledge of materials, specifications, manufacturing processes and design tools utilized for multi-chip modules, PWBs and CCAs.
• Proficient with AutoCAD.
• Familiarity with NX or other 3D modeling software.

Basic Qualifications for Senior Principal Mechanical Electronic Packaging Engineer:

• Bachelor’s degree with 8 years of experience, a Master’s degree with 6 years of experience or a PhD with 3 years of experience in Mechanical Engineering, Electrical Engineering, Computer Engineering, Computer Science, or related technical fields. Will consider 13 years of applied experience in lieu of degree requirement.
• U.S Citizenship with the ability to obtain/maintain an active DoD Secret Clearance.
• Experience with microelectronic packaging design, including chip-scale packaging technologies and substrate/PWB layout.
• Working knowledge of materials, specifications, manufacturing processes and design tools utilized for multi-chip modules, PWBs and CCAs.
• Proficient with AutoCAD.
• Familiarity with NX or other 3D modeling software.

Preferred Qualifications:

• Advanced degrees in Mechanical Engineering, Electrical Engineering, Computer Engineering, Computer Science, or related technical fields.
• Active DoD Secret Clearance or higher.
• Proficiency with ASME Y14.5 geometric dimensioning and tolerancing (GD&T) and ASME Y14.100 engineering drawing practices.
• Familiarity with thermal and structural analysis considerations, methodologies, and software tools.
• Experience with hands-on assembly and testing of prototype electronic hardware.
• Experience in a technical leadership role on a cross-functional product development team.

This positions standard work schedule is a 9/80. The 9/80 schedule allows employees who work a nine-hour day Monday through Thursday to take every other Friday off.

As a full-time employee of Northrop Grumman Mission Systems, you are eligible for our robust benefits package including:

• 401k
• Educational Assistance
• Life Insurance
• Employee Assistance Programs & Work/Life Solutions

Northrop Grumman is committed to hiring and retaining a diverse workforce. We are proud to be an Equal Opportunity/Affirmative Action Employer, making decisions without regard to race, color, religion, creed, sex, sexual orientation, gender identity, marital status, national origin, age, veteran status, disability, or any other protected class.