Company:
L3Harris Technologies
Location: Grant-Valkaria
Closing Date: 24/10/2024
Hours: Full Time
Type: Permanent
Job Requirements / Description
Job Title: Yield Engineer, Advanced Packaging
Job Code: 16920
Job Location: Palm Bay, FL
Job Description:
L3Harris Technologies is seeking a highly motivated Advanced Packaging Yield Engineer to join the Microelectronics Division at Palm Bay, FL location. As a member of our dynamic and collaborative environment, you will be responsible for developing semiconductor process controls and yield analysis techniques to support the production of advanced electronic systems from pilot-line to full-scale production. We are looking for a candidate who is passionate about their work, thrives in a fast-paced environment, and has a strong background in semiconductor yield engineering for advanced packaging applications. If you are ready to take on new challenges and contribute to the success of our company, we would love to hear from you.
Essential Functions:
Serve as the manufacturing authority for yield analysis and optimization in 2.5D/3D integrated device systems for advanced packaging efforts.
Develop and implement strategies to improve yield and reduce defects in the manufacturing of 2.5D/3D integrated packages from pilot-line through high-volume production.
Develop and implement state-of-the-art yield simulation techniques for advanced package processes and systems.
Partner with Process Integration and Design Engineering teams to develop Process Control Monitor (PCM) and electronic test structure strategies.
Partner with Process Integration Engineering to develop yield improvement and process margins improvement roadmaps to ensure manufacturing ramps of new technologies can be met.
Work multifunctionally with Design, Technology Development, and Manufacturing teams to ensure seamless integration of yield simulation results and yield optimization techniques.
Keep current with industry trends and advancements in advanced packaging yield analysis and simulation techniques.
Continuously evaluate PCM, inline statistical process control (SPC), and electrical performance data and provide recommendations to improve yield, enhance product quality, and meet cost targets.
Assist in troubleshooting product- and design-limited yield issues using structured problem-solving methods to ensure high-quality, cost-effective production.
Develop and maintain accurate and detailed documentation of yield simulation processes and results.
Prepare detailed reports and presentations for management, project stakeholders, and customers highlighting yield trends, project progress, and yield improvement opportunities.
Ensure compliance with all safety and quality standards.
Stay organized and meet project deadlines in a fast-paced environment.
Coach and mentor junior engineers on yield optimization and simulation techniques.
Maintain a positive attitude and contribute to a collaborative and inclusive work environment.
Represent the company and its values in a professional and ethical manner.
Maintain a safe and organized work environment.
Qualifications:
Bachelor’s Degree and minimum 9 years of prior relevant experience; or Graduate Degree and a minimum of 7 years of prior related experience.
Degree concentration in Electrical, Mechanical, Computer Engineering, Chemistry, Physics, Materials, or related field
5+ years’ experience within the semiconductor industry focused on advanced packaging yield engineering
Ability to obtain a Top Secret Clearance
Ability to travel domestically and/or internationally 25% or more
Subject matter expert with comprehensive knowledge in advanced packaging
Strong leadership skills and experience in managing cross-functional teams
In-depth knowledge of project management
Preferred Additional Skills:
10+ years’ experience in the advanced packaging industry
Previous experience in one or more of the following semiconductor process areas: lithography, wet etch, dry etch, deposition, CMP, metrology, etc.
Hold an Active Top Secret Clearance
Experience working in classified government programs
Extensive expertise in using statistical software and tools for data analysis, such as JMP, Minitab, or Python
Excellent problem-solving skills and the ability to work effectively in a fast-paced and evolving environment
Flexibility with job responsibilities and pro-active with assuming additional responsibilities related to scope
Strong collaboration skills focused on positive team dynamics and the ability to communicate effectively across multi-functional teams
Ability to effectively prioritize multiple sophisticated and complex tasks
Tenacity to work effectively under tight timelines and limited resources
Ability to work with minimal direction with a strong sense of responsibility, ownership, and follow-through
Employ a growth mindset and seek opportunities to work multi-functionally, network, and gain competency across domains.
Job Code: 16920
Job Location: Palm Bay, FL
Job Description:
L3Harris Technologies is seeking a highly motivated Advanced Packaging Yield Engineer to join the Microelectronics Division at Palm Bay, FL location. As a member of our dynamic and collaborative environment, you will be responsible for developing semiconductor process controls and yield analysis techniques to support the production of advanced electronic systems from pilot-line to full-scale production. We are looking for a candidate who is passionate about their work, thrives in a fast-paced environment, and has a strong background in semiconductor yield engineering for advanced packaging applications. If you are ready to take on new challenges and contribute to the success of our company, we would love to hear from you.
Essential Functions:
Serve as the manufacturing authority for yield analysis and optimization in 2.5D/3D integrated device systems for advanced packaging efforts.
Develop and implement strategies to improve yield and reduce defects in the manufacturing of 2.5D/3D integrated packages from pilot-line through high-volume production.
Develop and implement state-of-the-art yield simulation techniques for advanced package processes and systems.
Partner with Process Integration and Design Engineering teams to develop Process Control Monitor (PCM) and electronic test structure strategies.
Partner with Process Integration Engineering to develop yield improvement and process margins improvement roadmaps to ensure manufacturing ramps of new technologies can be met.
Work multifunctionally with Design, Technology Development, and Manufacturing teams to ensure seamless integration of yield simulation results and yield optimization techniques.
Keep current with industry trends and advancements in advanced packaging yield analysis and simulation techniques.
Continuously evaluate PCM, inline statistical process control (SPC), and electrical performance data and provide recommendations to improve yield, enhance product quality, and meet cost targets.
Assist in troubleshooting product- and design-limited yield issues using structured problem-solving methods to ensure high-quality, cost-effective production.
Develop and maintain accurate and detailed documentation of yield simulation processes and results.
Prepare detailed reports and presentations for management, project stakeholders, and customers highlighting yield trends, project progress, and yield improvement opportunities.
Ensure compliance with all safety and quality standards.
Stay organized and meet project deadlines in a fast-paced environment.
Coach and mentor junior engineers on yield optimization and simulation techniques.
Maintain a positive attitude and contribute to a collaborative and inclusive work environment.
Represent the company and its values in a professional and ethical manner.
Maintain a safe and organized work environment.
Qualifications:
Bachelor’s Degree and minimum 9 years of prior relevant experience; or Graduate Degree and a minimum of 7 years of prior related experience.
Degree concentration in Electrical, Mechanical, Computer Engineering, Chemistry, Physics, Materials, or related field
5+ years’ experience within the semiconductor industry focused on advanced packaging yield engineering
Ability to obtain a Top Secret Clearance
Ability to travel domestically and/or internationally 25% or more
Subject matter expert with comprehensive knowledge in advanced packaging
Strong leadership skills and experience in managing cross-functional teams
In-depth knowledge of project management
Preferred Additional Skills:
10+ years’ experience in the advanced packaging industry
Previous experience in one or more of the following semiconductor process areas: lithography, wet etch, dry etch, deposition, CMP, metrology, etc.
Hold an Active Top Secret Clearance
Experience working in classified government programs
Extensive expertise in using statistical software and tools for data analysis, such as JMP, Minitab, or Python
Excellent problem-solving skills and the ability to work effectively in a fast-paced and evolving environment
Flexibility with job responsibilities and pro-active with assuming additional responsibilities related to scope
Strong collaboration skills focused on positive team dynamics and the ability to communicate effectively across multi-functional teams
Ability to effectively prioritize multiple sophisticated and complex tasks
Tenacity to work effectively under tight timelines and limited resources
Ability to work with minimal direction with a strong sense of responsibility, ownership, and follow-through
Employ a growth mindset and seek opportunities to work multi-functionally, network, and gain competency across domains.
Share this job
L3Harris Technologies
Useful Links